Oracle gets into the “Internet of Everything”

Oracle Corp. is following behind Cisco Systems in the chase to get a piece of the lucrative $14 trillion “Internet of Everything” opportunity.

The Redwood Shores, Calif.-based software vendor  announced that its Java ME Embedded will be positioned as the company’s machine-to-machine (M2M) solution.

According to Oracle, the rapid growth of the ‘Internet of Things’ is driving demand for open and cross-industry platforms that can help customers decrease time to market, manage costs and deliver new capabilities for embedded devices. Oracle plans to address these challenges with the latest release of Java Platform, Micro Edition (Java ME) Embedded, which provides support for embedded chip architectures and new binaries for ARM architecture-based developer boards, including the Raspberry Pi and the Keil STM32 F200 Evaluation Board for ARM Cortex-M processor-based devices.

Oracle also released a Java ME Software Development Kit (SDK) 3.3, a client Java runtime toolkit for microcontrollers and other resource-constrained devices.

Along with the new Java release, Oracle also has a channel strategy for its pursuit of the Internet of Everything. The company introduced a Java Platform Integrator program to provide channel partners with the ability to customize Java ME Embedded products to reach different device types and market segments.

The new channel program will focus on:

  • Reduce the engineering effort required to enable their application and services across multiple platforms;
  • Increase their opportunity for added product value and differentiation;
  • More rapidly deploy and monetize standard Oracle Java ME Embedded implementations to help them explore new business opportunities;
  • Benefit from Oracle’s lifetime support, patches and updates to further extend time-in-market for their applications beyond the lifespan of the underlying hardware; and
  • Reduces time to market and ongoing costs though a pre-integrated and optimized Java Embedded stack.

Chris Rommel, vice president of M2M & Embedded Technology at VDC Research said time-to-market and cost pressures are already forcing ODMs and OEMs to re-evaluate their solution stack and identify new opportunities for engineering synergies.

“However, the edge devices under development today must also be designed to become tomorrow’s channels for post-deployment software and service delivery. More than ever, engineering organizations should consider new, integrated development solutions that can both offer an opportunity to focus internal resource investments on application-level differentiation, as well as establish a platform for net new revenue generation,” Rommel added.

 

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Jim Love, Chief Content Officer, IT World Canada

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